廣垣 俊樹, 青山 栄一, 片山 傳生, 中川 平三郎, 中村 隆英, 下河 洋平, 井上 久弘
材料
53
(5),
553-559,
2004
In the current manufacture of multi-layer printed wiring boards, AFRP (Aramid Fiber Reinforced Plastices) has been attracted attention, because of its low coefficient of linear thermal expansion in …
DOI
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参考文献9件