赤外線サーモグラフィによるプリント基板のマイクロドリル加工現象のモニター アラミド繊維強化基板の加工時のドリル温度について
廣垣俊樹, 青山栄一, 片山傳生, 中川平三郎, 中村隆英… - 材料, 2004 - jstage.jst.go.jp
In the current manufacture of multi-layer printed wiring boards, AFRP (Aramid Fiber Reinforced
Plastices) has been attracted attention, because of its low coefficient of linear thermal …
Plastices) has been attracted attention, because of its low coefficient of linear thermal …